Tensorgrip LP64

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TensorGrip LP64 is suitable for bonding HPL and fabrics to a variety of substrates including MDF, chipboard, plywood and many other timber sheet materials. TensorGrip LP64 is designed for permanent bonding of materials where immediate bond strength and high heat resistance are required. TensorGrip L64 can also be used for bonding sheet metals, where surface preparation is very important – surface must be degreased and lightly abraded with fine abrasive or non-woven material.

  • Fast Drying
  • Good Heat Resistance
  • High Solids
  • Portable System
  • Easy Application Control
  • Suitable for Post-forming
  • High Performance Neoprene-based Resin System

    ALWAYS test TensorGrip L64 to determine suitability for your particular application prior to use in production.

    Technical Datasheet
    Safety Datasheet

  • This product was added to our catalog on Wednesday 20 May, 2015.